We act as a distributor for manufacturers who want to sell their products in the Japanese market.
Manufacturers
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Ferro Tec MeiVac
A film formation device for thick alumina film used in thin film heads in the magnetic storage industry.
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TMC Normal pressure CVD
An atmospheric pressure CVD system by TMC.
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Productivity tools
A tool that safely mounts and unmounts heavy items from devices.
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Mini Helium Kit
This device is designed to be able to perform leak checks for high pressure gas on semiconductor
manufacturing lines. -
Skytech
SKYTECH is a Taiwan-based manufacturer of semiconductor manufacturing equipment for front-end and back-end semiconductor development and mass production lines, helping customers improve their productivity.
PVD Tool
PVD systems with up to six chamber positions are available in customised chamber configurations according to customer requirements, depending on the thin-film processing structure; ICP, Degas and long-throw configurations are also available as options.
ALD Tool
With up to six chamber positions, ALD equipment can be configured for deposition and chamber configuration according to customer requirements.As an option for effective pre- or post-treatment, the treatment chamber can be either Thermal-ALD or PE-ALD, depending on temperature and plasma damage concerns.
Bonder Tool
EFEM with three load ports and two bonder stations.There is a robot/aligner, a coater with EBR functionality and a Prebake station, which can use either wax or adhesive, depending on customer requirements; can be used as a combo machine with De-Bonder; can be used as a stand-alone machine or as a combination machine with De-Bonder; can be used as a stand-alone machine with De-Bonder.
De-Bonder Tool
EFEM with four load ports and two thermal slide debonding stations.Available with robot/aligner and cleaner, configurable to customer requirements; can also be used as a combo machine with Bonder.
Powder ALD Tool
Applies to powder coating and effectively protects the powder.Optional ozone generator provides a wider choice of oxidation sources.
Descum / Plasma Polish Tool
Can be used as a PR or PI residue removal system using a descam, and can also be applied to laser release layers, ABF dry etching and plasma polishing to remove damaged layers on SiC chips after polishing Two chambers can be configured to dock directly into the EFEM, minimising clean room space andOne transfer chamber can be used to combine with other applications, accommodating up to six chambers for different purposes.Chamber configurations can be customised to meet customer requirements.
Single Wafer Load Lock Tool
A special Load Lock design for experimental and small-scale production lines, characterised by a small footprint and low cost.A dry pump is used to create a vacuum and balance the chamber pressure.
PVD Carbon Tool
This equipment is used to deposit a carbon layer on the surface of SiC MOSFETs as a cap layer to prevent silicon sublimation after the implantation process.
The PVD carbon equipment can accommodate up to six chambers and the chamber configuration can be customised according to customer requirements.